Lead-free Die-Attach Adhesive for Power Electronics

To date, because of the thermal stress to which they are subjected, power components had to besoldered to the leadframe. But the future of component manufacturing has arrived: MicrobondGecko. Finally, Die-Attach connections on power components can bebonded with adhesives - quickly andreliably - without lead.

The new conductive adhesive was developed by Umicoreand is unique to the market. Now every electronicsystem can be truly lead-free - no exceptions and across every temperature range.

Extract of the newsletter published within the IMAPS organization.

Certification

Decades of innovation and experience in materials for Die-Attach applications.

From the start, we took three considerations to heart: customer satisfaction, innovation and product quality.

These maxims guide our daily work since customer satisfactioncan only come from quality products.

Sticks to where it belongs.

After intensive examinations and comparisons with high-lead containing solders one thing is crystal clear: the winner is MicrobondGecko - lead-free power sticking.

MicrobondGecko keeps its promises under any condition and for every application.

Say good-bye to soldering ...

MicrobondGecko - say good-bye to soldering and welcome to power sticking.
Low void rate. Easy to dispense Cu-filled Printable Perfect joint quality. Due to the similar behavior of MicrobondGecko, replacing of solder pastes is easy: solder paste out and clean lead-free adhesive in.

That's it!